Printed Circuit Board Assembly

TS3 produces a variety of printed circuit board assemblies using advanced technologies including surface mount, through-hole, ball grid array, chip scale packaging and mixed technologies. Our experienced and well-trained team designs, assembles and tests your printed circuit board assemblies using state-of-the-art tools and advanced placement techniques.

• High reliability soldering and assembly
• Surface mount, through-hole, mixed technology
• Fine pitch SMT
• BGA
• Automatic placement technique
• Conformal coating
• ICT, Functional test, Flying Probe and AOI

TS3 is customer dedicated organization that can respond rapidly to your needs and seamlessly integrate design or production modifications. Our NPI process is a team based structure that creates a flexible approach allowing us to adapt our manufacturing processes to accommodate prototype to full-volume production, short or long runs.

TS3 is proud of its production team -- trained and certified to the highest industry standards for soldering and workmanship.

Backplane Assemblies

TS3 manufactures backplane assemblies in low and medium volume. We have the ability to test and to press fit connectors in various types of backplanes. Many of these assemblies are integrated into sub-assemblies or top-level assemblies or used with other products manufactured by TS3.